Kemampuan dimensi Semikonduktor heatsink ini meningkat hingga menjadi adaptor yang dapat menjadi power suplay adaptor di dalam mobil.
Berikut daftar part dan schema psu adapter (gambar terpisah)
Resistor:
R1 = 5k6
R2 = 51K (51k1)
R3 = 9k1 (9k1)
R4 = 1M
R5 = 4k7
R6, R8 = 15k
R7 = 27k
R9, R10 = 6,8
R11 = 10k
R12 = 100
P1 = 5k preset
Capacitors:
C1-C4 = 3300µF 16V, radial, low ESR, diam. 12.5 mm, e.g. Panasonic EEUFC1C332 (Farnell)
C5,C10 = 1µF MKT, advance angle 5mm or 7.5mm (larger adaptation preferred)
C12 = 1µF MKT, advance angle 5 mm
C6-C9 = 2200µF 25V radial, low ESR, diam. 12.5mm, e.g., EEUFC1E222 (Farnell)
C11 = 22nF, advance angle 5mm
C13 = 2nF2, advance angle 5mm
C14,C15 = 100nF ceramic, advance angle 5mm
C16 = 10µF 63V radial
Inductors:
L1 = 56µH, 21 turns 10 x 0.5 mm ECW, parallel
1 x ETD 29 braid forner, vertical mounting, Epcos B66359X1014T1 (Schuricht # 331622)
2 x ETD 29 clamp, Epcos B66359-A2000 (Schuricht # 333862)
2 x ETD 29 amount half, actual # N67, air gap 0.5mm, Epcos B66358-G500-X167 (Schuricht # 333840)
Semiconductors:
D1 = MBR1645 (International Rectifier) (e.g. Reichelt, Segor)
T1 = IRL2505 (International Rectifier) TO-220AB case, (e.g., RS Components)
T2 = BD139
T3 = BD140
IC1 = UC3843N (Texas Instruments) (e.g. Reichelt, Segor)
Miscellaneous:
K1-K4 = 2-way burrow terminal, vertical, PCB mount
F1 = fuse, 10A/T (slow) 6.3 x 32 mm (¼ x 1¼ inch) + 2 agglutinate holders for 6.3 mm bore and PCB mounting
2 x heatsink blazon SK104-STC (or STS) TO220 38.1mm, 11K/W (Fischer Electronic) Isolating washers for T1 and D1 (TO-220AB) + isolating bushes
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